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US 8,008,582 B2Granted
Anisotropic electrically conductive structure
Assignee3M Innovative Properties Company
InventorMasashi Shimada
Life of this patent
Estimating the term…
Abstract
An anisotropic electrically conductive structure comprising: a dielectric matrix having a first surface and a second surface; a heat curable adhesive layer disposed on at least one or both of said first surface and said second surface; a plurality of passages at least extending from said first surface of said matrix to said second surface of said matrix; and electrically conductive members in said passages; wherein said dielectric matrix does not exhibit thermal fluidization at a temperature required for heat curing of said heat curable adhesive layer.
Claims6
An anisotropic electrically conductive structure comprising:
- a dielectric matrix having a first surface and a second surface;
- a heat curable adhesive layer disposed on at least one or both of said first surface and said second surface, wherein said heat curable adhesive layer comprises a caprolactone-modified epoxy resin, and wherein the heat curable adhesive layer further comprises a thermoplastic phenoxy resin;
- a plurality of passages at least extending from said first surface of said dielectric matrix to said second surface of said dielectric matrix;
- and
- electrically conductive members in said passages, wherein the electrically conductive members assure a plurality of electrically conductive paths extending from said first surface to said second surface;
- wherein said dielectric matrix does not exhibit thermal fluidization at a temperature required for heat curing of said heat curable adhesive layer.
3 more elements
Dependencies are inferred from the claim text.