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US 8,008,579 B2Granted
Printed circuit board providing heat dissipation
AssigneeHon Hai Precision Industry Co., Ltd.
InventorMing-Chun Cheng
Life of this patent
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Abstract
A printed circuit board includes an insulated base sheet, a heat-conducting layer, and a plurality of heat-conducting blocks. The heat-conducting layer is disposed on the insulated base sheet. The heat-conducting blocks are formed on the heat-conducting layer. Each of the heat-conducting blocks is separated from each other.
Claims11
A printed circuit board, comprising:
- an insulated base sheet;
- a heat-conducting layer disposed on the insulated base sheet;
- an insulated layer partially coated on the heat-conducting layer, leaving a plurality of exposed zones remaining thereon;
- and
- a plurality of circular heat-conducting blocks formed on the heat-conducting layer, each of the heat-conducting blocks being separated from each other, and the heat-conducting blocks being correspondingly arrayed on the exposed zones of the insulated layer.
2 more elements
Dependencies are inferred from the claim text.