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AssigneeInternational Business Machines Corporation
InventorsMichael R. Sievers, Kaushik A. Kumar, Andres F. Munoz, Richard Wise
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A technique is described whereby temperature gradients are created within a semiconductor wafer. Temperature sensitive etching and/or deposition processes are then employed. These temperature sensitive processes proceed at different rates in regions with different temperatures. To reduce pinch off in etching processes, a temperature sensitive etch process is selected and a temperature gradient is created between the surface and subsurface of a wafer such that the etching process proceeds more slowly at the surface than deeper in the wafer. This reduces “crusting” of solid reaction products at trench openings, thereby eliminating pinch off in many cases. Similar temperature-sensitive deposition processes can be employed to produce void-free high aspect ratio conductors and trench fills.
A method of forming high aspect ratio structures in a semiconductor wafer, comprising the steps of:
A method of producing controlled undercuts in a semiconductor wafer, comprising the steps of:
Dependencies are inferred from the claim text.