Large scale method and furnace system for selenization of thin film photovoltaic materials
AssigneeStion Corporation
InventorRobert D. Wieting
Life of this patent
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Abstract
A method for fabricating a copper indium diselenide semiconductor film is provided using substrates having a copper and indium composite structure. The substrates are placed vertically in a furnace and a gas including a selenide species and a carrier gas are introduced. The temperature is increased from about 350° C. to about 450° C. to initiate formation of a copper indium diselenide film from the copper and indium composite on the substrates.
Claims36
A method for fabricating a copper indium diselenide semiconductor film comprising:
- providing a plurality of substrates, each of the substrates having a copper and indium composite structure;
- transferring the plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5;
- introducing a gaseous species including a selenide species and a first carrier gas into the furnace and transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature ranging from about 350° C. to about 450° C. to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates;
- maintaining the temperature at about the second temperature for a period of time;
- removing at least residual selenide species from the furnace;
- introducing a sulfide species into the furnace;
- holding the temperature at a predetermined level to allow the plurality of substrates to reach a predetermined level of temperature uniformity;
- and
- increasing a temperature to a third temperature, the third temperature ranging from about 500° C. to 525° C. or greater while the plurality of substrates are maintained in an environment including a sulfur species to extract at least one selenium species from the copper indium diselenide film.
A method for fabricating a copper indium diselenide semiconductor film comprising:
- transferring a plurality of substrates into a furnace, each of the plurality of substrates provided in a vertical orientation with respect to a direction of gravity, the plurality of substrates being defined by a number N, where N is greater than 5, each of the substrates having at least a copper and indium composite structure;
- introducing a gaseous species including a selenide species and a carrier gas comprising a nitrogen species into the furnace;
- transferring thermal energy into the furnace to increase a temperature from a first temperature to a second temperature ranging from about 350 degrees Celsius to about 450 degrees Celsius to at least initiate formation of a copper indium diselenide film from the copper and indium composite structure on each of the substrates;
- selectively introducing additional carrier gas into the furnace to maintain a substantially uniform temperature profile within the furnace during transferring of the thermal energy or another process within the furnace.
The method for fabricating a copper indium diselenide semiconductor film according to exclaim 24 wherein the second temperature ranges from about 390 degrees Celsius to about 410 degrees Celsius.
Dependencies are inferred from the claim text.