Conductive interconnect structures and formation methods using supercritical fluids

A method for processing a substrate, comprising:

• forming a via in a substrate, the via having an opening proximate to a bond site proximate a first surface of the substrate, a bottom portion in the substrate, and a sidewall between the opening and the bottom portion;
• precipitating a conductive material from a precursor in a supercritical fluid onto the sidewall of the via, the conductive material being generally conformal to the sidewall of the via;
• forming a vent hole in the substrate with the conformal conductive material on the sidewall of the via, the vent hole extending from the bottom portion of the via to a second surface of the substrate opposite the first surface;
• and
• filling the via with a fill material adjacent to the conformal conductive material after forming the vent hole.

A method for processing a substrate, comprising:

• forming a via in a substrate having a first surface and a second surface, the via having an opening proximate to the first surface of the substrate, a bottom portion in the substrate, and a sidewall generally transverse to a width of the opening;
• introducing a precursor of a conductive material carried in a supercritical fluid to the sidewall of the via;
• precipitating the conductive material from the precursor in the supercritical fluid onto the sidewall of the via, the precipitated conductive material being generally conformal to the sidewall of the via;
• and
• after forming the conformal conductive material, forming a vent hole in the substrate extending from the bottom portion of the via to the second surface of the substrate.