Semiconductor device and method for manufacturing the same
AssigneeRenesas Electronics Corporation
InventorMasaya Kawano
Life of this patent
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Abstract
A semiconductor device having a through electrode excellent in performance as for an electrode and manufacturing stability is provided. There is provided a through electrode composed of a conductive small diameter plug and a conductive large diameter plug on a semiconductor device. A cross sectional area of the small diameter plug is made larger than a cross sectional area and a diameter of a connection plug, and is made smaller than a cross sectional area and a diameter of the large diameter plug. In addition, a protruding portion formed in such a way that the small diameter plug is projected from the silicon substrate is put into an upper face of the large diameter plug. Further, an upper face of the small diameter plug is connected to a first interconnect.
Claims13
A method for manufacturing a semiconductor device comprising:
- forming a first hole at a main surface of a semiconductor substrate;
- forming a first conductive plug in said first hole;
- forming a second hole at a rear surface of said semiconductor substrate to expose said first conductive plug therein, said second hole being surrounded by a ring-shaped trench;
- and
- forming a second conductive plug in said second hole to be connected to said first conductive plug.
A method for manufacturing a semiconductor device comprising:
- forming an opening at a main surface of a semiconductor substrate;
- filling said opening with an insulating material;
- forming an insulating layer on said semiconductor substrate;
- forming a first hole penetrating said insulating layer to expose a part of said insulating material in a bottom of said first hole;
- forming a first conductive plug in said first hole;
- removing a part of said semiconductor substrate at a rear surface of said semiconductor substrate to expose said insulating material;
- removing said insulating material to form a second hole, a part of said first conductive plug is exposed in said second hole;
- and
- forming a second conductive plug in said second hole to be connected to said part of first conductive plug exposed in said second hole.
Dependencies are inferred from the claim text.