Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
AssigneePPG Industries Ohio, Inc.
InventorsKevin C. Olson, Alan E. Wang
Life of this patent
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Abstract
A method is provided comprising: coating an electrically conductive core with a first removable material, creating openings in the first removable material to expose portions of the electrically conductive core, plating a conductive material onto the exposed portions of the electrically conductive core, coating the conductive material with a second removable material, removing the first removable material, electrophoretically coating the electrically conductive core with a dielectric coating, and removing the second removable material.
Claims16
A method for coating an electrically conductive core, the method comprising:
- coating an electrically conductive core with a first removable material;
- creating openings in the first removable material to expose portions of the electrically conductive core;
- plating a conductive material onto the exposed portions of the electrically conductive core;
- coating the conductive material with a second removable material;
- removing the first removable material;
- electrophoretically coating the electrically conductive core with a dielectric coating;
- and
- removing the second removable material.
A method for coating an electrically conductive core, the method comprising:
- applying a layer of a first conductive material to a substrate having a dielectric coating on a conductive core and conductive vias extending through openings in the dielectric coating;
- applying a layer of a first removable material to the first conductive material;
- forming openings in the first removable material to expose areas of the conductive material to be plated;
- plating a second conductive material onto the exposed areas of the first conductive material;
- applying a layer of a second removable material to the first and second conductive material;
- forming openings in the second removable material to expose areas of the second conductive material to be plated;
- and
- plating a third conductive material onto the exposed areas of the second conductive material.
Dependencies are inferred from the claim text.