US 8,008,183 B2 · Dual capillary IC wirebonding

Abstract

The invention discloses apparatus and methods for the formation of bond wires in integrated circuit assemblies by attaching two separate wires using a dual capillary bond head. The separate wires are preferably non-identical, for example, being of different gauges and/or material composition. According to a preferred embodiment of the invention, dual capillary bond head apparatus includes a rotatable ultrasonic horn with a pair of capillaries for selectably dispensing separate strands of bond wire and for forming bonds on bond targets. According to another aspect of the invention, a method is provided for dual capillary IC wirebonding including steps for using two dual capillary bond heads for contemporaneously attaching non-identical bond wires to selected bond targets on one or more IC package assemblies.

Claims11

Dependent claims

A method for IC wirebonding comprising the steps of:

bringing a first capillary of a dual capillary bond head to bear on a plurality of bond targets on an IC package assembly, the first capillary affixed to an ultrasonic horn;
dispensing a first wire from the first capillary and attaching one or more first bond wires to selected bond targets;
and then
rotating the ultrasonic horn thereby displacing the first capillary and bringing a second capillary affixed to the ultrasonic horn and at a fixed acute angle with respect to the first capillary to bear on a plurality of bond targets on the IC package assembly;
and
dispensing a second wire from the second capillary and attaching one or more second bond wires to selected bond targets.

3 more elements

Dependencies are inferred from the claim text.

Dual capillary IC wirebonding

Life of this patent

Dual capillary IC wirebonding

Life of this patent

Abstract

Claims11