Method of manufacturing semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsRyota Fujitsuka, Katsuaki Natori, Daisuke Nishida, Masayuki Tanaka, Katsuyuki Sekine, Yoshio Ozawa, Akihito Yamamoto
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AssigneeKabushiki Kaisha Toshiba
InventorsRyota Fujitsuka, Katsuaki Natori, Daisuke Nishida, Masayuki Tanaka, Katsuyuki Sekine, Yoshio Ozawa, Akihito Yamamoto
Estimating the term…
A method of manufacturing a semiconductor device comprising a first insulating film formed on a semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film, forming the second insulating film comprises forming a lower insulating film containing oxygen and a metal element, thermally treating the lower insulating film in an atmosphere containing oxidizing gas, and forming an upper insulating film on the thermally treated lower insulating film using film forming gas containing at least one of hydrogen and chlorine.
A method of manufacturing a semiconductor device comprising a first insulating film formed on a semiconductor substrate, a charge storage layer formed on the first insulating film, a second insulating film formed on the charge storage layer, and a control electrode formed on the second insulating film,
Dependencies are inferred from the claim text.