Chip package with channel stiffener frame
AssigneeGlobalfoundries Inc.
InventorsEric Tosaya, Jun Zhai, Chia-Ken Leong, Tom Ley
Life of this patent
Estimating the term…
Abstract
Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices on the first side. A stiffener frame is coupled on the first side. The stiffener frame has first and second spaced apart opposing walls that define a channel in which the first plurality of passive devices is positioned, and a central opening that does not cover a central portion of the first side of the substrate.
Claims21
A method of manufacturing, comprising:
- providing a substrate having a first side and a first plurality of passive devices on the first side;
- and
- coupling a stiffener frame on the first side, the stiffener frame having first and second spaced apart opposing walls defining a channel in which the first plurality of passive devices is positioned, and a central opening not covering a central portion of the first side of the substrate;
- wherein the channel surrounds the central opening.
A method of manufacturing, comprising:
- forming a stiffener frame having first and second spaced apart opposing walls coupled to a top portion and defining an open channel, and a central opening;
- coupling the stiffener frame to a substrate having a first side and a first plurality of passive devices on the first side, the open channel being positioned over the first plurality of passive devices with the central opening not covering a central portion of the first side of the substrate;
- wherein the channel surrounds the central opening.
A method of manufacturing, comprising:
- providing a substrate having a first side and a first plurality of passive devices on the first side;
- coupling a stiffener frame on the first side, the stiffener frame having first and second spaced apart opposing walls defining a channel in which the first plurality of passive devices is positioned, and a central opening not covering a central portion of the first side of the substrate;
- wherein the channel surrounds the central opening;
- mounting a semiconductor chip on the central portion of the first side of the substrate;
- and
- coupling a lid to the stiffener frame to cover the semiconductor chip.
Dependencies are inferred from the claim text.