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US 8,008,130 B2Granted
Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board
AssigneeRenesas Electronics Corporation
InventorHirokazu Honda
Life of this patent
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Abstract
In accordance with the present invention, during formation of the interconnection board, the interconnection board remains securely fixed to a high rigidity plate being higher in rigidity than the interconnection board for suppressing the interconnection board from being bent.
Claims19
A method of forming an interconnection board, comprising:
- forming an interconnection board on a plate;
- and
- removing said plate from a first side of said interconnection board thereby exposing at least one external electrode pad having an exposed surface level with said first side so that said first side and said exposed surface form a single flat plane;
- forming a supporting plate having a plurality of holes corresponding to the exposed at least one external electrode pad of said interconnection board, into which a plurality of external electrodes are inserted, so that said supporting plate extends in parallel to a second surface of a buffer layer to form an inter-space between said supporting plate and said second surface of said buffer layer;
- and
- forming a supporting sealing resin material which fills said inter-space and surrounding parts of said external electrodes so that said supporting sealing resin material is in contact with said parts of said external electrodes for supporting said external electrodes,
- wherein during the forming of said interconnection board, said interconnection board remains fixed to said plate, and during the removing said plate the exposed surface of said at least one external electrode pad remains exposed.
4 more elements
A method of forming an interconnection board, comprising:
- forming an interconnection board on a plate;
- and
- removing said plate from a first side of said interconnection board thereby exposing at least one external electrode pad having an exposed surface level with said first side so that said first side and said exposed surface form a single flat plane;
- bonding a plurality of column-shaped electrically conductive layers to said exposed at least one external electrode pad of said interconnection board via an adhesive;
- forming external electrodes on said plurality of column-shaped electrically conductive layers so that said external electrodes are electrically connected through said plurality of column-shaped electrically conductive layers to said exposed at least one external electrode pad of said interconnection board;
- forming a supporting plate having a plurality of holes corresponding to said exposed at least one external electrode pad of said interconnection board, into which said plurality of column-shaped electrically conductive layers with said external electrodes are inserted, and said supporting plate extending in parallel to a second surface of said interconnection board to form an inter-space between said supporting plate and said second surface of said interconnection board;
- and
- forming a supporting sealing resin material which fills said inter-space and surrounds both said plurality of column-shaped electrically conductive layers and parts of said external electrodes so that said supporting sealing resin material is in contact with said plurality of column-shaped electrically conductive layers and said parts of said external electrodes for supporting said external electrodes;
- wherein during the forming of said interconnection board, said interconnection board remains fixed to said plate, and during the removing said plate the exposed surface of said at least one external electrode pad remains exposed.
6 more elements
Dependencies are inferred from the claim text.