Adhesive film for semiconductor and semiconductor device using the adhesive film
AssigneeSumitomo Bakelite Co., Ltd.
InventorHiroyuki Yasuda
Life of this patent
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Abstract
An adhesive film for a semiconductor containing an (A) ester (meth)acrylate copolymer and a (B) thermoplastic resin other than the ester (meth)acrylate copolymer, and composed so as to satisfy the following formula (1) for two hours from 10 minutes after starting measurement, in which γ represents an amount of shearing strain produced upon undergoing a shearing stress of 3000 Pa at a frequency of 1 Hz and a temperature of 175° C. on parallel plates of 20 mm in diameter, exhibits superior filling performance in surface unevenness of a substrate through an encapsulating material sealing process, despite that semiconductor chips are stacked in multiple layers in the semiconductor device and hence a wire bonding process imposes a longer thermal history. 0.10≦γ≦0.30 (1)
Claims11
An adhesive film for a semiconductor to be used for stacking semiconductor chips in two or more layers, comprising:
- (A) an ester (meth)acrylate copolymer;
- and
- (B) a thermoplastic resin other than said ester (meth)acrylate copolymer;
- said adhesive film for a semiconductor have a shearing strain γ satisfying the following formula (1) for two hours from 10 minutes after starting measurement, in which the shearing strain γ represents an amount of shearing strain produced upon undergoing a shearing stress of 3000 Pa at a frequency of 1 Hz and a temperature of 175° C., on parallel plates of 20 mm in diameter:
- 0.10≦γ≦0.30 (1)
- wherein the adhesive film is substantially free from a thermosetting resin.
Dependencies are inferred from the claim text.