Solid-state imaging device, method of producing the same, and camera
AssigneeSony Corporation
InventorsHideo Kanbe, Takayuki Ezaki
Life of this patent
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AssigneeSony Corporation
InventorsHideo Kanbe, Takayuki Ezaki
Estimating the term…
To provide a solid-state imaging device able to improve light transmittance of a transparent insulation film in a light incident side of a substrate, suppress the dark current, and prevent a quantum efficiently loss, wherein a pixel circuit is formed in a first surface of the substrate and light is received from a second surface, and having: a light receiving unit formed in the substrate and for generating a signal charge corresponding to an amount of incidence light and storing it; a transparent first insulation film formed on the second surface; and a transparent second insulation film formed on the first insulation film and for retaining a charge having the same polarity as the signal charge in an interface of the first insulation film or in inside, thicknesses of the first and second insulation film being determined to obtain a transmittance higher than when using only the first insulation film.
A method of producing a solid-state imaging device comprising the steps of:
Dependencies are inferred from the claim text.