Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, and method for producing printed wiring board
AssigneeHitachi Chemical Company, Ltd.
InventorMitsuaki Watanabe
Life of this patent
Estimating the term…
Abstract
The photosensitive resin composition of the invention is characterized by comprising (A) a binder polymer, (B) a photopolymerizing compound with at least one polymerizable ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1). In formula (1), R1, R2, R3 and R4 are each independently hydrogen or a compound of the following general formula (2). In general formula (2), R5 represents a C4-30 hydrocarbon group.
Claims19
A photosensitive resin composition comprising (A) a binder polymer containing a carboxyl group, (B) a photopolymerizing compound with at least one polymerizable ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1):
- [In general formula (1), R1, R2, R3 and R4 each independently represent hydrogen or a monovalent group represented by the following general formula (2):
- (In general formula (2), R5 represents a C4-30 hydrocarbon group)].
Dependencies are inferred from the claim text.