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US 8,007,676 B2Granted
Slurry compositions, methods of preparing slurry compositions, and methods of polishing an object using slurry compositions
AssigneeSamsung Electronics Co., Ltd.
InventorsJae-Hyun So, Sung-Taek Moon, Dong-Jun Lee, Nam-Soo Kim, Bong-Su Ahn, Kyoung-Moon Kang
Life of this patent
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Abstract
A slurry composition includes an acidic aqueous solution and one or both of, an amphoteric surfactant and a glycol compound. Examples of the amphoteric surfactant include a betaine compound and an amino acid compound, and examples of the amino acid compound include lysine, proline and arginine. Examples of the glycol compound include diethylene glycol, ethylene glycol and polyethylene glycol.
Claims15
A method of preparing a slurry composition used for polishing an object having a metal, the method comprising:
- mixing an acid, an abrasive, a carboxylic acid and pure water to prepare a first mixture;
- pressurizing and dispersing the first mixture;
- adding a glycol compound and an amphoteric surfactant to the pressurized and dispersed first mixture to prepare a second mixture;
- and
- adding a peroxide compound to the second mixture,
- wherein the glycol compound acts in the slurry composition to reduce decomposition of the peroxide compound to maintain a constant concentration of the peroxide compound in the slurry composition.
3 more elements
A method of polishing an object, comprising:
- preparing a slurry composition by mixing an acid, an abrasive, a carboxylic acid, and pure water to form a first mixture, pressurizing and dispersing the first mixture, and adding to the first mixture an amphoteric surfactant and a glycol compound;
- providing the slurry composition to a polishing pad;
- and
- polishing a surface of an object by contacting the polishing pad with the slurry composition against the surface of the object, the surface of the object having a metal.
1 more element
Dependencies are inferred from the claim text.