Method of manufacturing circuit board
AssigneeYazaki Corporation
InventorsHiroyuki Fujita, Yasutaka Ochiai, Minoru Kubota
Life of this patent
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Abstract
An adhesive layer, an insulating layer and a copper foil are laminated together on both surfaces of a metallic base material by way of for example thermal press molding. In this case, openings (window holes) are formed in opposed positions on a portion of the adhesive layer. A circuit pattern is formed by etching on the copper foil in this state, followed by an external shape machining step of executing separation treatment reaching the metallic base material in predetermined positions including the openings. After that, a part of the insulating layer is cut off along the edge of the opening to obtain a circuit board with the end of the metallic base material exposed.
Claims10
A method of manufacturing a circuit board comprising:
- a laminating step of laminating adhesive layers on both surfaces of a metallic base material respectively, laminating insulating layers on the adhesive layers respectively, and laminating a layer conductor on at least one of the insulating layers, wherein an opening is formed in a portion of at least one of the adhesive layers;
- a circuit pattern forming step of forming a circuit pattern by dissolving and removing a portion of the layer conductor with an etching process;
- an external shape machining step of performing external shape machining of the circuit board by cutting the metallic base material in a predetermined position corresponding to the opening formed in the adhesive layer;
- and
- an insulating layer cutting step of cutting off a portion of the insulating layer which covers the opening formed in the adhesive layer to expose the surface of the metallic base material corresponding to the position of the opening.
A method of manufacturing a circuit board comprising:
- a laminating step of forming a mold release mask on a portion of at least one of both surfaces of the metallic base material, laminating insulating layers on the both surfaces of the metallic base material including the portion where the mold release mask is formed, and laminating a layer conductor on at least one of the insulating layers;
- a circuit pattern forming step of forming a circuit pattern by dissolving and removing a portion of the layer conductor with an etching process;
- an external shape machining step of performing external shape machining of a circuit board by cutting off the metallic base material in a predetermined position corresponding to the mold release mask formed on the metallic base material;
- and
- an insulating layer cutting step of cutting off a portion of the insulating layer which covers the mold release mask formed on the metallic base material and remove the mold release mask from the surface of the metallic base material to expose the surface of the metallic base material.
Dependencies are inferred from the claim text.