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US 8,007,626 B2Granted
Micro-fluidic interconnector
AssigneeLehigh University
InventorsAshish V. Pattekar, Mayuresh V. Kothare
Life of this patent
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AssigneeLehigh University
InventorsAshish V. Pattekar, Mayuresh V. Kothare
Estimating the term…
A method of bonding a capillary tube made of a thermally deformable material to a passage in a glass wafer comprising the steps of treating the surface of the capillary tube to render the surface bondable and wettable by a conventional epoxy resin; inserting a support inside the capillary to prevent inward deformation of the capillary during subsequent fabricating steps; inserting the supported capillary inside the port on the wafer; heating an end of the capillary proximate a bottom portion of the port to effect melting of a portion of the heated end of the capillaries; moving the melted end of the capillary into contact with a wall of the port at a desired location for the capillary in the port, thus forming a temporary seal between the capillary and the wall of the port; and introducing an epoxy around the capillary to bind the capillary to the wafer.
A method of bonding a capillary tube made of polytetrafluoroethylene or other suitable thermally deformable material to a port in a glass wafer comprising the steps of:
A method of bonding a capillary tube made of thermally deformable material to a port that is disposed in a wafer comprising the steps of:
A method of bonding a capillary tube made of thermally deformable material to a port that is disposed in a wafer comprising the steps of:
Dependencies are inferred from the claim text.