US 8,007,593 B2 · Remover compositions

Abstract

A remover composition containing 1,3-propanediamine (a), 1-hydroxyethylidene-1, 1-diphosphonic acid (b) and water, wherein the remover composition contains the component (a) in an amount of from 0.2 to 30% by weight, the component (b) in an amount of from 0.05 to 10% by weight, and the water in an amount of from 60 to 99.75% by weight, and wherein the composition has a pH at 20° C. of from 9 to 13; and a remover composition containing an organic amine (A), an organic phosphonic acid (B), a linear sugar alcohol (C) and water, wherein the remover composition contains the component (A) in an amount of from 0.2 to 30% by weight, the component (B) in an amount of from 0.05 to 10% by weight, the component (C) in an amount of from 0.1 to 10% by weight, and the water in an amount of from 50 to 99.65% by weight, and wherein the composition has a pH at 20° C. of from 9 to 13.

Claims3

Dependent claims

A process for cleaning a semiconductor substrate or semiconductor element, comprising the step of cleaning the semiconductor substrate or semiconductor element with a remover composition comprising:

(A) an organic amine, (B) an organic phosphonic acid, (C) a linear sugar alcohol, and water,
wherein the remover composition comprises the component (A) in an amount of from 0.2 to 30% by weight, the component (B) in an amount of from 0.05 to 10% by weight, the component (C) in an amount of from 0.1 to 10% by weight, and the water in an amount of from 50 to 99.65% by weight,
a weight ratio of the component (C) to a total amount of the component (A) and the component (B) in the remover composition is from 1/0.3 to 1/0.8, and
wherein the remover composition has a pH at 20° C. of from 9 to 13.

1 more element

Dependencies are inferred from the claim text.

Remover compositions

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Remover compositions

Life of this patent

Abstract

Claims3