Vapor-phase epitaxial growth method and vapor-phase epitaxy apparatus

A vapor phase epitaxial growth method using a vapor phase epitaxy apparatus having a chamber, a support structure holding thereon a substrate in the chamber, a first flow path supplying a reactant gas for film formation on the substrate and a second flow path for exhaust of the gas, said method comprising:

• rotating the substrate;
• supplying the reactant gas and a carrier gas to thereby perform vapor-phase epitaxial growth of a semiconductor film on the substrate;
• and
• during the vapor-phase epitaxial growth of the semiconductor film on the substrate, controlling process parameters to make said semiconductor film uniform in thickness, said process parameters including flow rates and concentrations of the reactant gas and the carrier gas, a degree of vacuum within said chamber, a temperature of the substrate, and a rotation speed of said substrate,
• wherein said reactant gas is trichlorosilane,
• wherein said carrier gas is hydrogen, and
• wherein the trichlorosilane is adjusted to be equal to or less than 8 percent (%) in concentration within said chamber with an internal pressure of said chamber being set at 6.7 to 10.6×104 pascals (Pa) while setting the rotation speed of the substrate to 500 to 1,500 revolutions per minute (rpm) and the temperature of the substrate to 1,100 to 1,140 degrees centigrade (° C.) to thereby cause said semiconductor layer to grow at a growth rate of 8 micrometers per minute (μm/min) or greater, resulting in an in-plane thickness distribution of said semiconductor layer being less than or equal to 0.5%.