Connector system having contact overlapping vias
AssigneeTyco Electronics Corporation
InventorsBruce Allen Champion, Steven Jay Millard, Bin Lin
Life of this patent
Estimating the term…
Abstract
An electronic connector system includes an electronic package and an interposer connector assembly. The electronic package has a body with a conductive member disposed on a mating surface of the body. The conductive member is coupled with a conductive via that extends into the body and is oriented along a center axis. The interposer connector assembly includes a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad. The contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact.
Claims16
An electronic connector system comprising:
- an electronic package having a body with a conductive member disposed on a mating surface of the body, the conductive member coupled with a conductive via that extends into the body and is oriented along a center axis;
- and
- an interposer connector assembly including a substrate with an elongated conductive pad mounted to the substrate and a contact joined to the conductive pad, wherein the contact engages the conductive member when the electronic package mates with the interposer connector assembly such that the center axis extends through the contact;
- wherein
- the contact of the interposer connector assembly extends over a footprint on the electronic package that is defined by a surface area on the electronic package over which the contact extends, at least a majority of the via disposed in the footprint.
An electronic connector system comprising:
- an electronic package having a body with a conductive member disposed on a mating surface of the body, the conductive member coupled with a conductive via that extends into the body;
- and
- an interposer connector assembly including a substrate with a conductive pad mounted to the substrate and an elongated contact joined to the conductive pad, wherein
- the contact having a footprint on the electronic package that is defined by a surface area on the mating surface of the electronic package over which the contact extends when the electronic package and the interposer connector assembly mate, further wherein at least a portion of the via is disposed within the footprint.
Dependencies are inferred from the claim text.