Circuit device and manufacturing method therefor
AssigneeSanyo Electric Co., Ltd.
InventorsRyosuke Usui, Takeshi Nakamura
Life of this patent
Estimating the term…
Abstract
A circuit device is made smaller in higher. The circuit device includes a wiring substrate, a first circuit element, and a second circuit element. The circuit substrate includes an insulating resin layer, a wiring layer provided on a main surface of the insulating resin layer, and a wiring layer provided on the other main surface of the insulating resin layer. The wiring layer includes first interconnectors to which the first circuit element connects, and wiring portions. The film thickness of the first interconnector is made thinner than that of the wiring portion. The wiring layer includes second interconnectors and wiring portions. The first interconnectors and the second interconnectors are connected through the medium of conductors.
Claims5
A wiring substrate on which a circuit element is mounted, the wiring substrate comprising:
- a substrate;
- a first interconnector and a first wiring portion on one face of the substrate;
- and
- a protective film provided with openings corresponding to a connection terminal part of the first interconnector and a connection terminal part of the first wiring portion,
- wherein the film thickness of the first interconnector is less than that of the first wiring portion, an upper surface of the first interconnector is lower than an upper surface of the first wiring portion, and the connection terminal part of the first wiring portion is covered with a metal whose ionization tendency is smaller than that of a metal forming the first interconnector.
A circuit device, comprising a wiring substrate, the wiring substrate comprising:
- a substrate;
- a first interconnector and a first wiring portion on one face of the substrate;
- and
- a protective film provided with openings corresponding to a connection terminal part of the first interconnector and a connection terminal part of the first wiring portion,
- wherein the film thickness of the first interconnector is less than that of the first wiring portion, an upper surface of the first interconnector is lower than an upper surface of the first wiring portion, and the connection terminal part of the first wiring portion is covered with a metal whose ionization tendency is smaller than that of a metal forming the first interconnector,
- the circuit device further comprising:
- a first circuit element flip-chip connected to the first interconnector;
- and
- a second circuit element mounted on the first circuit element, wherein the metal covering the connection terminal part of the first wiring portion is connected to the second circuit element by a wire.
Dependencies are inferred from the claim text.