Wireless IC device
AssigneeMurata Manufacturing Co., Ltd.
InventorNoboru Kato
Life of this patent
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Abstract
An article package formed from, for example, an aluminum-evaporated laminated film includes a cut-out section, which has no aluminum-evaporated layer, in an edge. An electromagnetic-coupling module is disposed in the cut-out section. A wireless IC device is constituted by the electromagnetic-coupling module and an aluminum-evaporated layer of the package. A magnetic-field antenna of the electromagnetic-coupling module is coupled to the aluminum-evaporated layer of the package. The whole of the article package acts as a radiator of the antenna.
Claims18
A wireless integrated circuit device comprising:
- a high-frequency device including a wireless integrated circuit chip;
- and
- a radiation electrode coupled to the high-frequency device mounted thereon, the radiation electrode being part of an article and acting as a radiator;
- wherein
- the radiation electrode includes a conductive portion having a predetermined area, the conductive portion includes a cut-out section in an edge thereof, the high-frequency device is disposed in the cut-out section, and the high-frequency device is coupled to the conductive portion within the cut-out section.
A wireless integrated circuit device comprising:
- a high-frequency device including a wireless integrated circuit chip;
- and
- a radiation electrode coupled to the high-frequency device mounted thereon, the radiation electrode being part of an article and acting as a radiator;
- wherein
- the radiation electrode includes a conductive portion having a predetermined area and including a non-conductive section, the high-frequency device is disposed at an edge in the non-conductive section, and the high-frequency device is coupled to the conductive portion being in the vicinity of the non-conductive section.
Dependencies are inferred from the claim text.