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US 8,006,747 B2Granted
Micro-chimney and thermosiphon die-level cooling
AssigneeIntel Corporation
InventorsGregory M. Chrysler, James G. Maveety
Life of this patent
Estimating the term…
Abstract
A semiconductor die is constructed and arranged to have at least one conduit portion therein. At least a portion of the conduit portion is proximate to the localized area. The conduit portion is at least partially filled with a heat-dissipating material. The conduit portion absorbs heat from the localized area and dissipates at least a portion of the heat away from the localized area.
Claims7
A method for dissipating heat from a localized area, the method comprising:
- providing a semiconductor die with at least one conduit directly within the semiconductor die, the conduit being proximate to the localized area within the semiconductor die, the conduit being at least partially filled with a heat-dissipating material;
- absorbing, by the conduit, heat from the localized area;
- and
- dissipating, by the conduit, at least a portion of the heat away from the localized area.
1 more element
Dependencies are inferred from the claim text.