Molding material mixture, molded part for foundry purposes and process of producing a molded part
AssigneeMinelco, Inc.
InventorsRalf-Joachim Gerlach, Bettina Wehren
Life of this patent
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Abstract
A molding material mixture for foundry purposes, comprising a mold sand, a sodium hydroxide solution, an alkali-silicate binding agent, and an additive suspension. The molding material mixture contains 0.1 to 10% by weight of sodium hydroxide solution with reference to the weight of the sand, 0.1 to 5% of binding agent with a solid matter percentage of 20 to 70%, and 0.1 to 3% by weight of the additive suspension. The additive suspension comprises 30 to 70% by volume of an amorphous, spherical SiO2 particles, which have a first grain size in the range of 1 to 5 micrometers, and a second grain size in the range of 0.01 to 0.05 micrometers.
Claims20
A molding material mixture for foundry purposes, comprising the following components:
- a mold sand;
- 0.1 to 10 percent by weight of a sodium hydroxide aqueous solution;
- 0.1 to 5 percent by weight of an alkali-silicate binding agent;
- and
- 0.1 to 3 percent by weight of an additive suspension;
- wherein:
- said mold sand comprises mold sand particles having a grain size of 0.1 to 1 mm;
- said sodium hydroxide aqueous solution comprises a concentration of 20 to 40 percent by weight of sodium hydroxide;
- said alkali-silicate binding agent comprises 20 to 70 percent by volume of alkali-silicate;
- said additive suspension comprises 30 to 70 percent by volume of amorphous, spherical SiO2 particles;
- each of said amorphous, spherical SiO2 particles having one of:
- a first grain size in the range of between 1 and 5 micrometers;
- and
- a second grain size in the range of between 0.01 and 0.05 micrometers;
- and
- the volumetric amount of amorphous, spherical SiO2 particles having the first grain size is in the range of 0.8 to 1.2 times the volumetric amount of amorphous, spherical SiO2 particles having the second grain size.
A molding material mixture for use in a foundry, said molding material mixture consisting of a mold sand, a sodium hydroxide aqueous solution, a binding agent based on alkali silicate and additives, wherein the mold sand particles comprise a grain size of 0.1 to 1 mm, the molding material mixture contains 0.1 to 10 percent by weight of sodium hydroxide aqueous solution with reference to the weight of the sand, and wherein the sodium hydroxide aqueous solution comprises a concentration of 20 to 40 percent by weight, the molding material mixture contains 0.1 to 5% of binding agent based on alkali silicate with a solid matter percentage of 20 to 70%, the molding material mixture, as the additive, contains 0.1 to 3 percent by weight of a suspension with a solid matter percentage of 30 to 70% of amorphous, spherical SiO2 in two grain size classifications in the suspension with a first grain size classification A containing SiO2 particles with a grain size ranging between 1 and 5 micrometers and with a second grain size classification B containing SiO2 particles with a grain size ranging between 0.01 and 0.05 micrometers, and wherein, the volumetric amount of amorphous, spherical SiO2 particles having the first grain size is in the range of 0.8 to 1.2 times the volumetric amount of amorphous, spherical SiO2 particles having the second grain size.
Dependencies are inferred from the claim text.