Surface acoustic wave pressure sensor
AssigneeDenso Corporation
InventorsAkihiko Teshigahara, Hideaki Yamada
Life of this patent
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Abstract
A sensor chip has a substrate and a comb-teeth electrode arranged on the substrate. The sensor chip is fixed to a diaphragm structure to be distorted by receiving pressure, and is fixed to the diaphragm structure only through a predetermined fix area so as to detect the pressure. The fix area is defined on only a part of the sensor chip opposing to the diaphragm structure. The sensor chip is restrained by the diaphragm structure in a direction of transmitting surface acoustic wave. Flexibility of the sensor chip in a perpendicular direction approximately perpendicular to the wave transmitting direction is larger than that in the transmitting direction.
Claims11
A surface acoustic wave pressure sensor comprising:
- a diaphragm structure having a diaphragm part to be distorted by receiving pressure;
- and
- a sensor chip having
- a substrate to generate surface acoustic wave, and
- a comb-teeth electrode arranged on the substrate, the electrode transmitting the wave through the substrate in a single wave transmitting direction, wherein
- the sensor chip is fixed to the diaphragm structure through a predetermined fix area so as to detect the pressure received by the diaphragm part,
- the fix area is defined on only a part of the sensor chip opposing to the diaphragm structure,
- the sensor chip is restrained by the diaphragm structure in the wave transmitting direction,
- the sensor chip has flexibility in a direction approximately perpendicular to the wave transmitting direction,
- the flexibility in the perpendicular direction is larger than that in the wave transmitting direction.
Dependencies are inferred from the claim text.