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US 8,006,370 B2Granted
Method for sealing a housing
AssigneeTyco Electronics AMP GmbH
InventorsRalf Hoffmann, Alexander Linke, Martin Wieberger, Titus Ziegler
Life of this patent
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Abstract
A method for sealing a housing includes providing a base plate of the housing with at least one opening; providing an electrical connection that extends through the base plate from an inner side to an outer side of the base plate; and applying a sealing compound into the opening from an outer side of the base plate in order to seal an interface between the base plate and the electrical connection.
Claims16
A method for sealing a housing, comprising:
- providing a base plate of the housing with a first opening and a second opening;
- providing an electrical connection that extends through the first opening from an inner side to an outer side of the base plate;
- and
- applying a sealing compound into the second opening from an outer side of the base plate in order to seal an interface between the base plate and the electrical connection.
1 more element
Dependencies are inferred from the claim text.