Method and apparatus of water cooling several parallel circuit cards each containing several chip packages

A cooling system for an electronic device, comprising:

• a plurality of heat producing electronic devices affixed to a substrate;
• heat transfer devices connected to the heat producing electronic devices and thermally communicating with the heat producing devices for transferring heat from the heat producing devices to the heat transfer devices, the heat transfer devices including metal, the heat transfer devices being in overlapping relation to the plurality of heat producing electronic devices;
• a heat conduit mechanically and thermally connected to the heat transfer devices, the heat conduit thermally communicating with the heat transfer devices for transferring heat to the heat conduit from the heat transfer device, and the heat transfer devices each mate with and thermally communicate with different portions of the heat producing electronic devices, and some of the different portions of the heat producing devices have differing dimensions, the heat conduit including metal and being releasably mechanically connected to the heat transfer devices;
• and
• a plurality of cooling housings mechanically and thermally connected to the heat conduit using clamping devices for releasably holding the heat conduit in contact with the cooling housings, the plurality of cooling housings define at least one passageway for circulating thermally conductive fluid, and the cooling housings thermally communicating with the heat conduit for transferring heat to the fluid of the cooling housings from the heat conduit, the plurality of cooling housings being releasably mechanically connected to the heat conduit, wherein the plurality of cooling housings transport the thermally conductive fluid therethrough for transferring heat from the heat transfer device and the heat conduit to the fluid, and the cooling housings support and position the heat conduit, the plurality of cooling housings being positioned adjacent the heat transfer device and the plurality of heat producing electronic devices, and the plurality of cooling housings not being in overlapping relation with the plurality of heat producing electronic devices and the heat transfer device, the cooling housings being self contained such that the fluid is contained in the plurality of cooling housings and not in contact with the heat transfer device and the heat conduit.

A method of cooling an electronic device, comprising:

• providing at least one heat producing electronic device;
• transferring heat from the heat producing electronic device to a heat transfer device, the heat transfer device being connected to and thermally communicating with the heat producing device;
• transferring heat to a heat conduit from the heat transfer device, the heat conduit being connected to and thermally communicating with the heat transfer device;
• transferring heat from the heat conduit to a thermally conductive fluid of a plurality of cooling housings, the cooling housings being connected to and thermally communicating with the heat conduit;
• positioning the cooling housings at opposite longitudinal ends of the heat producing electronic device and the heat conduit and traversing a plane defined by the heat producing electronic device, the plurality of cooling housings being releasably mechanically connected to the heat conduit, wherein the plurality of cooling housings transport the thermally conductive fluid therethrough for transferring heat from the heat transfer device and the heat conduit to the fluid, and the cooling housings support and position the heat conduit;
• releasably coupling the heat conduit to the cooling housings using a plurality of mounting devices being part of each of the plurality of cooling housings;
• and
• positioning the of cooling housings adjacent the heat transfer device and the plurality of heat producing electronic devices, and the plurality of cooling housings not being in overlapping relation with the plurality of heat producing electronic devices and the heat transfer device, the cooling housings being self contained such that the fluid is contained in the plurality of cooling housings and not in contact with the heat transfer device and the heat conduit.