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US 8,002,935 B2Granted
Forming method for polymeric laminated wafers comprising different film materials
AssigneeInsight Equity A.P.X., L.P.
InventorHideyo Sugimura
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Abstract
A method of making a polymeric laminated wafer comprising different film materials that are softenable and formable at different softening temperatures corresponding with the film materials. Also disclosed is a laminated wafer wherein a first layer has different thermal properties than a second layer of the wafer.
Claims7
A method for forming a laminated wafer comprising the following steps in the sequence set forth:
- (a) placing the laminated wafer having at least a cellulose resin protective layer and a polycarbonate base layer in a heated environment having a first temperature capable of softening at least the base layer;
- (b) exposing the base layer to heat at a second temperature higher than the first temperature;
- and
- (c) allowing the laminated wafer to form into a desired shape.
1 more element
A method of forming a laminated wafer comprising the following steps in the sequence set forth:
- (a) heating a cellulose resin protective layer of said laminated wafer to a first temperature equal at least to a softening temperature of the first the cellulose resin protective layer;
- (b) heating a polycarbonate base layer of said laminated wafer to a second temperature equal at least to a softening temperature of the polycarbonate base layer, the second temperature being higher than the first temperature;
- and
- (c) forming the laminated wafer into a desired shape.
1 more element
Dependencies are inferred from the claim text.