Cooling system for contact cooled electronic modules

A method of cooling an electronic equipment module, the method comprising:

• placing the electronic equipment module in proximity to a flexible cold plate in a support structure;
• coupling the flexible cold plate to an external cooling system;
• circulating cooling fluid between the external cooling system and internal passageways of the flexible cold plate;
• and
• applying a substantially equal force across a face of the flexible cold plate in response to an applied rotational force.

A system to cool an electronic component within an electronic module, the system being arranged such that the electronic module is hand-mountable to the system, the system comprising:

• a first flexible coldplate thermally coupled to the electronic component, wherein the first flexible coldplate cools the electronic component, the first flexible coldplate having a passageway to allow a cooling fluid to flow therein;
• a plate substantially coupled to an entire first face of the first flexible coldplate;
• a thermal interface material including an encapsulated layer of a thermally conducting grease, the thermal interface material coupled between a second face of the first flexible coldplate and the electronic component, the thermal interface material to thermally couple the first flexible coldplate to the electronic component to increase the heat transfer therebetween as pressure is applied from the plate toward the electronic component;
• and
• a mechanism to provide a space between the first flexible coldplate and the electronic component to assist in insertion or removal of the electronic module, the mechanism further imparting a compressive, substantially equally distributed force substantially normal to a face of the plate, the compressive force to substantially flatten the first flexible coldplate and the thermal interface material against the electronic component, thereby causing the thermal interface material to conform to the space between the first flexible coldplate and the electronic component to increase the heat transfer between the flexible coldplate and electronic component.

A method of hand-mounting and cooling an electronic module containing an electronic component, the method comprising:

• providing a space between a flexible coldplate and the electronic component to assist in insertion or removal of the electronic module by using a mechanism;
• coupling the electronic component to the flexible coldplate for cooling the electronic component, the flexible coldplate having at least one passageway allowing a cooling fluid to flow therein;
• coupling substantially an entire first face of the flexible coldplate to a plate;
• coupling a thermal interface material including an encapsulated layer of a thermally conducting grease between a second face of the flexible coldplate and the electronic component, the thermal interface material thermally coupling the electronic component to the flexible coldplate;
• and
• applying pressure from the plate toward the electronic component, thereby increasing the heat transfer therebetween;
• and imparting a compressive force substantially normal to a face of the plate by using the mechanism, the compressive force substantially flattening the flexible coldplate and the thermal interface material against the electronic component, thereby conforming the thermal interface material to a space between the flexible coldplate and the electronic component, increasing the heat transfer between the flexible coldplate and the electronic component.