Method for direct fabrication of nanostructures
AssigneeMassachusetts Institute of Technology
InventorsBrian Hubert, Joseph Jacobson, Aggelos Bletsas
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Abstract
An all-additive method for direct fabrication of nanometer-scale planar and multilayer structures comprises the steps of acquiring a transferable material with a submillimeter-scale tip, depositing at least a portion of the acquired first transferable material at a predetermined location onto a substrate without a bridging medium, and repeating to create a structure using the transferable material.
Claims41
A method of assembling a structure, the method comprising the steps of:
- (a) providing a submillimeter-scale tip;
- and
- (b) pick-and-place depositing a first transferable material, comprising:
- (b)(i) causing the tip to acquire the first transferable material from a reservoir;
- (b)(ii) operating the tip to deposit at least a portion of the acquired first transferable material at a predetermined location onto a substrate without a bridging medium;
- and
- (b)(iii) repeating steps (b)(i) and b(ii) to create a structure using the first transferable material.
A method of assembling a nanostructure, the method comprising the steps of:
- (a) providing a submillimeter-scale tip comprising a plurality of sub-tips disposed in a predetermined arrangement;
- and
- (b) pick-and-place depositing a first transferable material, comprising:
- (b)(i) causing the tip to acquire the first transferable material;
- (b)(ii) operating the tip to deposit at least a portion of the acquired first transferable material at a predetermined location onto a substrate without a bridging medium;
- and
- (b)(iii) repeating steps (b)(i) and (b)(ii) to create a structure using the first transferable material.
A method of assembling a structure, the method comprising the steps of:
- (a) providing a submillimeter-scale tip;
- (b) causing the tip to mechanically vibrate;
- (c) monitoring a shift in a vibration frequency of the tip;
- (d) causing the tip to acquire a first transferable material;
- (e) operating the tip to deposit at least a portion of the acquired first transferable material at a predetermined location onto a substrate without a bridging medium;
- and
- (f) repeating steps (b) to (e) to create a structure using the first transferable material.
Dependencies are inferred from the claim text.