Adhesive tape cutting method and adhesive tape joining apparatus using the same
AssigneeNitto Denko Corporation
InventorsMasayuki Yamamoto, Saburo Miyamoto
Life of this patent
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Abstract
In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.
Claims4
A method for cutting a supporting adhesive tape through which a ring frame holds a semiconductor wafer, the method comprising the steps of:
- cutting an adhesive tape along a contour of a ring frame while maintaining constant a distance from a reference plane of a cutter holder, which is an attachment base end of a cutter blade, to a cutting edge of the cutter blade penetrating through the adhesive tape joined to the ring frame and bringing the cutting edge of the cutter blade close to the ring frame;
- measuring a distance from the reference plane to the cutting edge of the cutter blade with a measuring device each time the adhesive tape is cut by a predetermined number of times while the adhesive tape is cut with the cutter blade;
- and
- maintaining the distance from the reference plane to the cutting edge of the cutter blade constant by adjusting a length of the cutter blade protruding from an oval hole of the cutter holder in accordance with a result of the measurement.
A method for cutting a supporting adhesive tape through which a ring frame holds a semiconductor wafer, the method comprising the steps of
- measuring a thickness of an adhesive tape on a cutting pathway of a cutter blade while cutting the adhesive tape with the cutter blade;
- adjusting a length of the cutter blade protruding from an oval hole of the cutter holder in accordance with a result of the measurement;
- and
- continuing cutting the adhesive tape while maintaining the distance from the reference plane to the cutting edge of the cutter blade constant by adjusting a length of the cutter blade protruding from an oval hole of the cutter holder in accordance with a result of the measurement.
Dependencies are inferred from the claim text.