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AssigneeThermal Cyclic Technologies TCTech i Stockholm AB
InventorsJan Jäderberg, Stefan Olin
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An injection-moulding device is disclosed, comprising at least first and second mould parts, defining a mould cavity, wherein at least one of the mould parts comprises heating means, for heating the mould part in the vicinity of a mould cavity surface, said heating means comprising an inductive coil having a plurality of windings and being powered by an oscillator. The mould part comprises a top member, at the mould cavity surface, and, beneath the top member, a carrier member comprising grooves for taking up said coil windings, wherein the top member resistivity is lower than 1.5*10−6 Ωm, the top member relative magnetic permeability is lower than 10, the carrier member resistivity is higher than 20*10−6 Ωm, and the carrier member relative magnetic permeability is higher than 50.
An injection-moulding device, comprising at least first and second mould parts, defining a mould cavity, wherein at least one of the mould parts comprises heating means, for heating the mould part in the vicinity of a mould cavity surface, said heating means comprising an inductive coil having a plurality of windings and being powered by an oscillator, characterized in that the mould part comprises a top member, at the mould cavity surface, and, beneath the top member, a carrier member comprising grooves for accommodating said coil windings, wherein the top member resistivity is lower than 1.5*10−6 Ωm, the top member relative magnetic permeability is lower than 10, the carrier member resistivity is higher than 20*10−6 Ωm, and the carrier member relative magnetic permeability is higher than 50.
Method for injection-moulding, wherein a liquid moulding compound is injected into a cavity, defined by a first and a second mould part, wherein at least one of the mould parts comprises heating means comprising an inductive coil, fed by an oscillator, for heating the mould part in the vicinity of an object cavity surface during a part of the injection-moulding process cycle, wherein during the heating, a magnetic flux is conveyed by a carrier member, the resistivity of which is higher than 20*10−6 Ωm and the relative magnetic permeability of which is higher than 50, to a top member, the resistivity of which is lower than 1.5*10−6 Ωm and the relative magnetic permeability of which is lower than 10, such that the top member is heated by eddy currents.
Dependencies are inferred from the claim text.