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US 7,976,750 B2Granted
Method of encapsulating optoelectronic components
AssigneeTesa SE
InventorsAxel Burmeister, Franziska Zmarsly
Life of this patent
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Abstract
Method of encapsulating optoelectronic components, by embedding the components to be encapsulated between a first transparent polymer layer and a second polymer layer, which is filled with unactivated foaming agent, and then activating the foaming agent, so that the two polymer layers join to one another, in particular weld to one another, and the components are enclosed between the two polymer layers.
Claims20
A method of encapsulating optoelectronic components, the method comprising:
- embedding optoelectronic components, to be encapsulated, between a first transparent polymer layer and a second polymer layer, wherein the second polymer layer is filled with an unactivated foaming agent that is present in an amount between 0.5% and 20% by weight of the second polymer layer;
- and
- activating the foaming agent, so that the two polymer layers inseparably join to one another, wherein the optoelectronic components are enclosed between the two polymer layers.
A method of encapsulating optoelectronic components, the method comprising:
- embedding optoelectronic components, to be encapsulated, between a first transparent polymer layer and a second polymer layer, wherein the second polymer layer is filled with an unactivated foaming agent;
- and
- activating the foaming agent, so that the two polymer layers are welded to one another and are inseparable from one another and the optoelectronic components are enclosed between the two polymer layers.
Dependencies are inferred from the claim text.