Process for producing microsphere with use of metal substrate having through-hole

A device for producing a microsphere, comprising:

• a case including a first plate, a substrate comprising a through-hole, and a second plate, which are spaced out in the case;
• a first channel through which a disperse phase flows and which is formed between the first plate and the substrate having a through-hole;
• a second channel through which a bed including a continuous phase and a microsphere flows and formed between the substrate having a through-hole and the second plate,
• wherein the substrate is a metal substrate comprising a through-hole, with a width of 0.5 to 500 μm a depth of 10 μm to 6000 μm, a ratio of the width to the depth of the through-hole (width/depth) of 1 to 1/30 (1/1 to 1/30), and a recess formed around an opening of the through-hole on a side where a microsphere is formed.