Method of manufacturing a semiconductor apparatus
AssigneeElpidia Memory, Inc.
InventorsMitsuhisa Watanabe, Ichiro Anjoh
Life of this patent
Estimating the term…
Abstract
A method of making a semiconductor apparatus provides a plurality of electrode pads on a main surface of a semiconductor chip, and a plurality of bump electrodes on the electrode pads. The method also provides a wired board which is allocated in a side of the main surface of the chip and is positioned in a central area of the main surface of the chip so as to be separated from an edge part of the chip by at least 50 μm or more, a plurality of external terminals on the wired board and which are electrically connected to a plurality of bump electrodes through wirings of the wired board, and a sealing part between the chip and the wired board, the sealing part being made of underfill material that covers a connection part between the bump electrode and the wiring.
Claims21
A semiconductor apparatus manufacturing method, comprising:
- providing a semiconductor wafer in which a semiconductor chip is formed, the semiconductor chip being provided with a predetermined circuit and a plurality of electrode pads on a main surface;
- forming bump electrodes on the plurality of electrode pads;
- providing a wired board whose area is smaller than that of the semiconductor chip, and which includes land parts corresponding to the plurality of electrode pads formed on the semiconductor chip respectively, and a wiring for electrically connecting the electrode pads and the land parts;
- mounting the wired board on the semiconductor chip which is determined as a non-defective product of the semiconductor chips formed on the semiconductor wafer by electrically connecting the electrode pads of the semiconductor chip and the wiring electrically connected to the land parts;
- and
- cutting and separating the semiconductor wafer on which the wired board is mounted onto each of the semiconductor chips, and picking up the separated semiconductor chip.
A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor wafer including a plurality of semiconductor chips therein, the semiconductor chips being defined by scribe lines and joined with one another, each of the semiconductor chips including a plurality of electrode pads on a side of a first main surface of the semiconductor wafer;
- providing a plurality of wired boards separately from one another, each of the wired boards being smaller in size than each of the semiconductor chips and including a plurality of terminals;
- mounting each of the wired boards on an associated one of the semiconductor chips in the semiconductor wafer to electrically connect the terminals of each of the wired boards to the electrode pads of the associated one of the semiconductor chips;
- and
- dicing the semiconductor wafer along the scribe lines thereof to separate the semiconductor chips each accompanying an associated one of the wired board from one another.
A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor chip which comprises a first surface, a second surface opposite to the first surface, and a plurality of electrode pads arranged in line in a central area of the first surface;
- providing a wired board that is smaller in size than the semiconductor chip, the wired board comprising a third surface, a fourth surface opposite to the third surface, a plurality of connection pads arranged in line in a central area of the third surface, and a plurality of land terminals formed on the fourth surface and electrically connected to the connection pads;
- and
- mounting the wired board on the semiconductor chip such that an edge of the wired board is distant from an edge of the semiconductor chip toward an inside of the semiconductor chip by at least 50 μm, the connection pads of the wired board being electrically connected to an associated one of the electrode pads of the semiconductor chip.
A method of manufacturing a semiconductor device, comprising:
- providing a semiconductor wafer including a plurality of semiconductor chips therein, the semiconductor chips being defined by scribe lines and joined with one another, each of the semiconductor chips including a plurality of electrodes on side of a first main surface of the semiconductor wafer;
- forming a protective layer on a second main surface of the semiconductor wafer that is a surface of the semiconductor wafer opposite to the first main surface;
- providing a plurality of wired boards separately from one another, each of the wired boards being smaller in size than each of the semiconductor chips and including a plurality of terminals;
- mounting each of the wired boards on an associated one of the semiconductor chips in the semiconductor wafer to electrically connect the terminals of each of the wired boards to the electrodes of the associated one of the semiconductor chips;
- and
- dicing the semiconductor wafer along the scribe lines thereof to separate the semiconductor chips each accompanying an associated one of the wired boards from one another.
Dependencies are inferred from the claim text.