Method for the manufacture of electronic devices on substrates and devices related thereto
AssigneesImec, Umicore AG & Co. KG
InventorsGiovanni Flamand, Wim Geens, Jef Poortmans
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Abstract
Methods for manufacturing electronic devices and devices produced by those methods are disclosed. One such method includes releasably bonding a first surface of a device substrate to a face of a first carrier substrate using a first bonding agent to produce a first composite substrate, where the face of the first carrier substrate includes a pattern of trenches. The method also includes processing the device substrate to manufacture an electronic device on a second surface of the device substrate. The method further includes releasing the device substrate from the first carrier substrate by a releasing agent.
Claims15
A method for the manufacture of an electronic device comprising:
- releasably bonding a first surface of a device substrate to a surface of a first carrier substrate using a first bonding agent to produce a first composite substrate;
- while the device substrate is bonded to the first carrier substrate, processing the device substrate to manufacture an electronic device at a second surface of the device substrate;
- and
- releasing the device substrate from the first carrier substrate using a releasing agent, wherein the surface of the first carrier substrate comprises a pattern of trenches formed in the first surface of the first carrier substrate, and wherein the first carrier substrate is free of any through holes.
Dependencies are inferred from the claim text.