Electronic package structure and method
AssigneeRichtek Technology Corporation
InventorYu-Lin Yang
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Abstract
An electronic package structure and method use a conductive strip to bond die-to-die, die-to-lead, chip carrier-to-lead, or lead-to-lead. A conductive strip may carry greater current than a bonding wire, and thus may replace several bonding wires. The bonding of the conductive strip may be carried out by an SMT process, and thus requires lower cost than wire bonding processes. A conductive strip may be bonded to more than two dice or leads to save more bonding wires. A conductive strip is stronger than a bonding wire, and thus lowers the possibility of being broken.
Claims1
An electronic packaging method comprising the steps of:
- providing a plurality of dice disposed on a common chip carrier, each die having a bonding pad thereon;
- spanning a conductive strip formed of a metal sheet across the bonding pads of at least two of the plurality of dice;
- and
- bonding the metal sheet to the bonding pads, at least one of the bonding pads having a bump thereon and the metal sheet being bonded thereto, the bonding of the metal sheet to the bonding pads including:
- applying a bonding material on the metal sheet or on the bonding pads;
- disposing the metal sheet on the bonding pads with the bonding material therebetween;
- and
- heat treatment for bonding the metal sheet to the bonding pads with the bonding material.
Dependencies are inferred from the claim text.