Sheet cutting table
AssigneeLintec Corporation
InventorsHideaki Nonaka, Kenji Kobayashi, Yoshiaki Sugishita
Life of this patent
Estimating the term…
Abstract
A sheet cutting table 13, after sticking an adhesive sheet S to a semiconductor wafer W, for cutting the area outside the semiconductor wafer W as an unnecessary adhesive sheet S1 with a cutting device 15. The table 13 includes an inner table 52 which supports the semiconductor wafer W, and an outer table 51 corresponding to the unnecessary adhesive sheet S1 outside the semiconductor wafer W. The upper surface of the outer table 51 is provided with a non-adherable treatment surface 51A, and an adherable member formed with a ring member 53 or a plate member 63 for sticking the adhesive sheet S thereto.
Claims17
A sheet cutting table for, after sticking an adhesive sheet having a larger plane area than that of a plate object to said plate object, cutting the area outside said plate object as an unnecessary adhesive sheet, said cutting table comprising:
- an inner table which forms a surface to place said plate object thereon;
- and
- an outer table, which is located outside said inner table, corresponding to said unnecessary adhesive sheet area;
- wherein
- an upper surface of said outer table is formed as a non-adherable treatment surface, and is provided with an adherable member which is configured for sticking said unnecessary adhesive sheet area thereto;
- said outer table comprises a step which is lower than and located inward from the non-adherable treatment surface;
- and
- said adherable member is positioned on said step.
A sheet cutting table for, after sticking an adhesive sheet having a larger plane area than that of a plate object to said plate object, cutting the area outside said plate object as an unnecessary adhesive sheet, said cutting table comprising:
- an inner table which forms a surface to place said plate object thereon;
- and
- an outer table, which is located outside said inner table, corresponding to said unnecessary adhesive sheet area;
- wherein
- an upper surface of said outer table is formed as a non-adherable treatment surface, and is provided with an adherable member which is configured for sticking said unnecessary adhesive sheet area thereto;
- said outer table comprises a plurality of holes which are arranged around the inner table and extend downward from the non-adherable treatment surface;
- and
- said adherable member comprises a plurality of solid members each removably received in any one of said hole for varying a sticking area of the outer table corresponding an adhesive force of the said adhesive sheet.
A sheet cutting table, comprising:
- an inner table for supporting thereon a plate object to which an adhesive sheet having a larger plan area than that of the plate object is to be stuck and cut along a periphery of the plate object;
- and
- an outer table located outside said inner table, wherein an upper surface of said outer table comprises:
- a non-adherable area contactable with but non-adherable to the adhesive sheet;
- and
- an adherable area contactable with and adherable to the adhesive sheet;
- and
- wherein said non-adherable area and said adherable area include different solid materials non-adherable and adherable, respectively, to the adhesive sheet.
Dependencies are inferred from the claim text.