Cleaning formulation for removing residues on surfaces
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorEmil Kneer
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a non-corrosive cleaning composition that is useful for removing residues from a semiconductor substrate. The composition can comprise water, at least one hydrazinocarboxylic acid ester, at least one water soluble carboxylic acid, optionally, at least one fluoride-containing compound, and, optionally, at least one corrosion inhibitor not containing a carboxyl group. The present disclosure also provides a method of cleaning residues from a semiconductor substrate using the non-corrosive cleaning composition.
Claims34
A cleaning composition comprising:
- water;
- at least one water soluble hydrazinocarboxylic acid ester;
- at least one water soluble carboxylic acid;
- optionally, at least one water soluble fluoride-containing material;
- and
- optionally, at least one corrosion inhibitor not containing carboxyl groups.
A cleaning composition, comprising:
- water;
- at least one water soluble hydrazinocarboxylic acid ester selected from the group consisting of:
- methyl carbazate, ethyl carbazate, tert-butyl carbazate, and benzyl carbazate;
- at least one water soluble carboxylic acid selected from the group consisting of:
- monocarboxylic acids with one additional ligand, monocarboxylic acids with two or more additional ligands, and polycarboxylic acids with additional ligands;
- at least one water soluble fluoride-containing material selected from the group consisting of:
- tetramethylammonium fluoride, tetrabutylammonium fluoride, and trimethylethyl ammonium fluoride;
- and
- optionally, at least one corrosion inhibitor not containing carboxyl groups.
A cleaning composition, comprising:
- water;
- about 0.01 wt % to about 15 wt % of at least one water soluble hydrazinocarboxylic acid ester;
- about 0.01 wt % to about 20 wt % of at least one water soluble carboxylic acid;
- about 0.0005 wt % to about 5 wt % of at least one water soluble fluoride-containing material;
- and
- optionally, at least one corrosion inhibitor not containing carboxyl groups.
A method of cleaning residues from a semiconductor substrate, the method comprising the steps of:
- providing a semiconductor substrate;
- contacting said semiconductor substrate with a cleaning composition, said cleaning composition comprising water, at least one water soluble hydrazinocarboxylic acid ester, at least one water soluble carboxylic acid, optionally, at least one water soluble fluoride-containing compound, and, optionally, at least one corrosion inhibitor not containing a carboxyl group;
- rinsing said semiconductor substrate with a suitable rinse solvent;
- and
- optionally, drying said semiconductor by any means that removes the rinse solvent and does not compromise the integrity of said semiconductor substrate.
A method of cleaning residues from a semiconductor substrate, the method comprising the steps of:
- providing a semiconductor substrate;
- contacting said semiconductor substrate with a cleaning composition;
- rinsing said semiconductor substrate with a suitable rinse solvent;
- and
- optionally, drying said semiconductor by any means that removes the rinse solvent and does not compromise the integrity of said semiconductor substrate,
- wherein said cleaning composition comprises:
- water;
- at least one water soluble hydrazinocarboxylic acid ester selected from the group consisting of:
- methyl carbazate, ethyl carbazate, tert-butyl carbazate, and benzyl carbazate;
- at least one water soluble carboxylic acid selected from the group consisting of:
- monocarboxylic acids with one additional ligand, monocarboxylic acids with two or more additional ligands, and polycarboxylic acids with additional ligands;
- at least one water soluble fluoride-containing material selected from the group consisting of:
- tetramethylammonium fluoride, tetrabutylammonium fluoride and trimethylethyl ammonium fluoride, and
- optionally, at least one corrosion inhibitor not containing a carboxyl group.
A cleaning composition comprising:
- water;
- at least one water soluble hydrazinocarboxylic acid ester;
- at least one water soluble carboxylic acid;
- at least one water soluble fluoride-containing material;
- and
- optionally, at least one corrosion inhibitor not containing carboxyl groups.
A cleaning composition comprising:
- at least about 45 wt % of water;
- at least one water soluble hydrazinocarboxylic acid ester;
- at least one water soluble carboxylic acid;
- optionally, at least one water soluble fluoride-containing material;
- and
- optionally, at least one corrosion inhibitor not containing carboxyl groups.
Dependencies are inferred from the claim text.