Pattern transfer printing by kinetic control of adhesion to an elastomeric stamp

A method of assembling a printable semiconductor element on a receiving surface of a receiving substrate, said method comprising:

• providing an elastomeric transfer device having a transfer surface;
• providing a donor substrate having a donor surface, said donor surface having at least one printable semiconductor element, wherein said printable semiconductor element is connected to said donor substrate via at least one bridge element;
• contacting at least a portion of said transfer surface with at least a portion of said printable semiconductor element;
• separating said transfer surface from said donor surface at a first separation rate such that said bridge element is fractured and said printable semiconductor element is transferred from said donor surface to said transfer surface, thereby forming said transfer surface having said printable semiconductor element disposed thereon;
• contacting at least a portion of said printable semiconductor element disposed on said transfer surface with said receiving surface of said receiving substrate;
• and
• separating said transfer surface from said feature at a second separation rate, wherein said first separation rate is larger than said second separation rate, thereby transferring said printable semiconductor element to said receiving surface.

A method of transferring a printable semiconductor element from a donor substrate surface to a transfer surface of an elastomeric transfer device, said method comprising:

• providing an elastomeric transfer device having said transfer surface;
• providing a donor substrate having a donor surface, said donor surface having said printable semiconductor element;
• contacting at least a portion of said transfer surface with at least a portion of said printable semiconductor element;
• separating said transfer surface from said donor surface at a rate greater than or equal to about 1 cm second−1 such that at least a portion of said printable semiconductor element is transferred from said donor surface to said transfer surface.

A method of transferring an array of printable semiconductor elements from a donor substrate surface to a transfer surface of an elastomeric transfer device, said method comprising:

• providing an elastomeric transfer device having said transfer surface;
• providing a donor substrate having a donor surface, said donor surface having said array of printable semiconductor elements;
• contacting at least a portion of said transfer surface with at least a portion of said array printable semiconductor elements;
• separating said transfer surface from said donor surface at a rate greater than or equal to about 1 cm second−1 such that at least a portion of said array of printable semiconductor elements is transferred from said donor surface to said transfer surface.

A method of temporarily transferring a feature from a donor substrate surface to a receiving surface of a receiving substrate for processing, said method comprising:

• providing an elastomeric transfer device having a transfer surface;
• providing a donor substrate having a donor surface, said donor surface having at least one feature;
• contacting at least a portion of said transfer surface with at least a portion of said feature;
• separating said transfer surface from said donor surface at a first separation rate such that at least a portion of said feature is transferred from said donor surface to said transfer surface, thereby forming said transfer surface having said feature disposed thereon;
• contacting at least a portion of said feature disposed on said transfer surface with said receiving surface of said receiving substrate;
• separating said transfer surface from said feature at a second separation rate, wherein said first separation rate is larger than said second separation rate, thereby transferring said feature to said receiving surface;
• processing said feature on said receiving surface to generate a processed feature;
• contacting at least a portion of said transfer surface with at least a portion of said processed feature;
• and
• separating said transfer surface from said receiving surface at a third separation rate such that at least a portion of said processed feature is transferred to said transfer surface.