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US 7,941,103 B2Granted
Duplexer
AssigneeTaiyo Yuden Co., Ltd.
InventorsYasuhide Iwamoto, Jun Tsutsumi, Masafumi Iwaki, Masanori Ueda
Life of this patent
Estimating the term…
Abstract
A duplexer includes a transmit filter of a ladder type filter, connected between a common terminal and a transmitting terminal, and a receive filter of the ladder type filter, connected between the common terminal and a receiving terminal. One or more parallel resonators in the transmit filter are grounded through a transmitting inductance, and a portion of multiple parallel resonators are grounded through a first receiving inductance and a remaining portion of the multiple parallel resonators are grounded through a second receiving inductance.
Claims13
A duplexer comprising:
- a transmit filter of a ladder type filter, connected between a common terminal and a transmitting terminal, wherein the transmit filter includes one or more parallel resonators and a transmitting inductance, the one or more parallel resonators being grounded through the transmitting inductance;
- a receiver filter of the ladder type filter, connected between the common terminal and a receiving terminal, wherein the receiver filter includes multiple parallel resonators, a first receiving inductance and a second receiving inductance, the multiple parallel resonators being grounded through the first receiving inductance and the second receiving inductance in a manner wherein at least one of the multiple parallel resonators is grounded through the first receiving inductance and the remainder multiple parallel resonators are grounded through the second receiving inductance, and wherein at least one of the first receiving inductance and the second receiving inductance is connected to more than one of the multiple parallel resonators;
- a stacked package with multiple layers, in which the transmit filter and the receive filter are mounted;
- a transmitting ground line pattern provided on one of the multiple layers and partially composing the transmitting inductance, wherein the transmitting ground line pattern is provided on a different layer from the first receiving ground line pattern and the second receiving ground line pattern;
- and
- a first receiving ground line pattern provided on one of the multiple layers and partially composing the first receiving inductance;
- and
- a second receiving ground pattern provided on one of the multiple layers and partially composing the second receiving inductance;
- wherein the first receiving ground line pattern and the second receiving ground line pattern are not provided on the one of the multiple layers on which the transmitting ground line pattern is provided.
6 more elements
A duplexer comprising:
- a transmit filter of a ladder type filter, connected between a common terminal and a transmitting terminal, wherein the transmit filter includes one or more parallel resonators and a transmitting inductance, the one or more parallel resonators being grounded through the transmitting inductance;
- a receiver filter of the ladder type filter, connected between the common terminal and a receiving terminal, wherein the receiver filter includes multiple parallel resonators, a first receiving inductance and a second receiving inductance, the multiple parallel resonators being grounded through the first receiving inductance and the second receiving inductance in a manner wherein at least one of the multiple parallel resonators is grounded through the first receiving inductance and the remainder multiple parallel resonators are grounded through the second receiving inductance, and wherein at least one of the first receiving inductance and the second receiving inductance is connected to more than one of the multiple parallel resonators;
- a stacked package with multiple layers, in which the transmit filter and the receive filter are mounted;
- a transmitting ground line pattern provided on one of the multiple layers and partially composing the transmitting inductance;
- a first receiving ground line pattern provided on one of the multiple layers and partially composing the first receiving inductance;
- and
- a second receiving ground pattern provided on one of the multiple layers and partially composing the second receiving inductance, wherein
- the first receiving ground line pattern and the second receiving ground line pattern are provided on different layer;
- the second receiving ground line pattern is not provided on the one of the multiple layers on which the first receiving ground line pattern is provided;
- and
- the first receiving ground line pattern is not provided on the one of the multiple layers on which the second receiving ground line pattern is provided.
8 more elements
A duplexer comprising:
- a transmit filter of a ladder type filter, connected between a common terminal and a transmitting terminal, wherein the transmit filter includes one or more parallel resonators and a transmitting inductance, the one or more parallel resonators being grounded through the transmitting inductance;
- a receiver filter of the ladder type filter, connected between the common terminal and a receiving terminal, wherein the receiver filter includes multiple parallel resonators, a first receiving inductance and a second receiving inductance, the multiple parallel resonators being grounded through the first receiving inductance and the second receiving inductance in a manner wherein at least one of the multiple parallel resonators is grounded through the first receiving inductance and the remainder multiple parallel resonators are grounded through the second receiving inductance, and wherein at least one of the first receiving inductance and the second receiving inductance is connected to more than one of the multiple parallel resonators;
- a stacked package with multiple layers, in which the transmit filter and the receive filter are mounted;
- a transmitting ground line pattern provided on one of the multiple layers and partially composing the transmitting inductance;
- a first receiving ground line pattern provided on one of the multiple layers and partially composing the first receiving inductance;
- a second receiving ground pattern provided on one of the multiple layers and partially composing the second receiving inductance;
- and
- a common signal line pattern provided on one of the multiple layers to couple the common terminal and either the transmit filter or the receive filter;
- a transmitting/receiving signal line pattern provided on one of the multiple layers to couple the transmit filter and the transmitting terminal or to couple the receive filter and the receiving terminal;
- and
- a partition ground line pattern that reduces a bridging capacitance between the common signal line pattern and the transmitting/receiving signal line pattern,
- wherein the partition ground line pattern is not disposed in at least one of a region in which the common signal line pattern is provided and a region in which the transmitting/receiving signal line pattern is provided.
9 more elements
Dependencies are inferred from the claim text.