Measurement structure in a standard cell for controlling process parameters during manufacturing of an integrated circuit

A standard cell library, comprising:

• a standard cell, wherein the standard cell is formed in a plurality of material layers of an integrated circuit to perform part of a function of the integrated circuit,
• wherein the plurality of material layers is configured to be patterned by a plurality of mask layers during manufacture of the integrated circuit,
• wherein the standard cell includes a measuring structure that is placed within boundaries of the standard cell,
• wherein the measuring structure includes at least one feature that is included in at least one of the plurality of material layers and the plurality of mask layers,
• wherein the at least one feature is configured to provide measurement results in order to control process parameters during manufacture of one of the material layers and mask layers.

An integrated circuit, comprising:

• a standard cell, wherein the standard cell is formed in a plurality of material layers of the integrated circuit to perform part of a function of the integrated circuit,
• wherein the plurality of material layers is configured to be patterned by a plurality of mask layers during manufacture of the integrated circuit,
• wherein the standard cell includes a measuring structure that is placed within boundaries of the standard cell,
• wherein the measuring structure includes at least one feature that is included in at least one of the plurality of material layers and the plurality of mask layers,
• wherein the at least one feature is configured to provide measurement results in order to control process parameters during manufacture of one of the material layers and mask layers.

A method of controlling process parameters during manufacture of an integrated circuit, comprising:

• providing a standard cell in a plurality of material layers of an integrated circuit to perform part of a function of the integrated circuit;
• wherein the plurality of material layers is configured to be patterned by a plurality of mask layers during manufacture of the integrated circuit;
• providing the standard cell within a placement area of the integrated circuit;
• providing a measuring structure within boundaries of the standard cell;
• providing at least one feature within the measuring structure in at least one of the plurality of material layers and the plurality of mask layers;
• and
• providing measurement results by the measuring structure in order to control process parameters during manufacture of one of the material layers and mask layers.

A non-transitory computer readable storage medium storing instructions that when executed by a computer cause the computer to perform a method of designing an integrated circuit, the method comprising:

• placing a standard cell within a placement area of the integrated circuit, wherein the standard cell includes a measuring structure that is placed within boundaries of the standard cell,
• wherein the standard cell is formed in a plurality of material layers of the integrated circuit to perform part of a function of the integrated circuit,
• wherein the plurality of material layers is configured to be patterned by a plurality of mask layers during manufacture of the integrated circuit,
• wherein the measuring structure includes at least one feature that is included in at least one of the plurality of material layers and the plurality of mask layers,
• wherein the at least one feature is configured to provide measurement results in order to control process parameters during manufacture of one of the material layers and mask layers.