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US 7,925,154 B2Granted
Camera module and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorJin Mun Ryu
Life of this patent
Estimating the term…
Abstract
Provided is a camera module including an image sensor module including a substrate; an image sensor that is mounted on a top surface of the substrate; a ground pad that is disposed on a bottom surface of the substrate; and a sealing member that seals the image sensor mounted on the substrate; a lens member that is stacked on the image sensor module; and a conductive member that is formed on side surfaces of the image sensor module and the lens member so as to be electrically connected to the ground pad.
Claims1
A camera module comprising:
- an image sensor module including
- a substrate,
- an image sensor mounted on a top surface of the substrate,
- a ground pad disposed on a bottom surface of the substrate, and
- a sealing member that seals the image sensor mounted on the substrate;
- a lens member stacked on the image sensor module;
- an iris member formed on the lens member,
- the iris member comprising a first iris that is a black pattern which exposes the lens and a second iris that is disposed on the first iris having a side surface inclined with respect to the lens;
- and
- a conductive member formed on side surfaces of the image sensor module, the lens member and the iris member, and electrically connected to the ground pad.
7 more elements
Dependencies are inferred from the claim text.