High-density semiconductor device
AssigneeHynix Semiconductor Inc.
InventorKie Bong Koo
Life of this patent
Estimating the term…
Abstract
A high-density semiconductor device includes a first input/output line connected among a plurality of banks on a core area storing data, so that it transmits data, a second input/output line connected to a data pad capable of performing data input/output operations at a Peri-area, so that it transmits data, a first repeater connected between the first input/output line and the second input/output line, for transmitting data of the first input/output line to the second input/output line in response to a read enable signal enabled by a read command, and a second repeater connected between the first input/output line and the second input/output line, for transmitting data of the second input/output line to the first input/output line in response to a write enable signal enabled by a write command.
Claims14
A high-density semiconductor device comprising:
- a first bank group and a second bank group on a core area;
- a first input/output line coupled to the first bank group, to transmit data;
- a second input/output line coupled to the second bank group, to transmit data;
- a data pad for inputting and outputting data on a peri area;
- a third input/output line coupled to the data pad, to transmit data;
- a first repeater comprising a first delay unit configured to delay a first read enable signal enabled by a read command for the first bank group by a predetermined period of time, a first buffer configured to buffer the first input/output line signal, a first transfer element configured to transfer an output signal of the first buffer as a first pull-up signal in response to the output signal of the first delay unit, and a second transfer element configured to transfer an output signal of the first buffer as a first pull-down signal in response to the output signal of the first delay unit, a first pull-up element configured to receive the first pull-up signal and pull-up the third input/output line, and a first pull-down element configured to receive the first pull-down signal and pull-down the third input/output line, wherein the first repeater is coupled between the first input/output line and the third input/output line.
A high-density semiconductor device comprising:
- a first bank group and a second bank group on a core area;
- a first input/output line coupled to the first bank group, to transmit data;
- a second input/output line coupled to the second bank group, to transmit data;
- a data pad for inputting and outputting data on a peri area;
- a third input/output line coupled to the data pad, to transmit data;
- a first repeater comprising a first delay unit configured to delay a first read enable signal enabled by a read command for the first bank group by a predetermined period of time, a first buffer configured to buffer the first input/output line signal, a first transfer element configured to transfer an output signal of the first buffer as a first pull-up signal in response to the output signal of the first delay unit, and a second transfer element configured to transfer an output signal of the first buffer as a first pull-down signal in response to the output signal of the first delay unit, a first pull-up element configured to receive the first pull-up signal and pull-up the third input/output line, and a first pull-down element configured to receive the first pull-down signal and pull-down the third input/output line,
- wherein the first buffer includes an inverter and the first and second transfer elements include respective transfer gates.
A high-density semiconductor device comprising:
- a first bank group and a second bank group on a core area;
- a first input/output line coupled to the first bank group, to transmit data;
- a second input/output line coupled to the second bank group, to transmit data;
- a data pad for inputting and outputting data on a peri area;
- a third input/output line coupled to the data pad, to transmit data;
- a first repeater comprising a first delay unit configured to delay a first read enable signal enabled by a read command for the first bank group by a predetermined period of time, a first buffer configured to buffer the first input/output line signal, a first transfer element configured to transfer an output signal of the first buffer as a first pull-up signal in response to the output signal of the first delay unit, and a second transfer element configured to transfer an output signal of the first buffer as a first pull-down signal in response to the output signal of the first delay unit, a first pull-up element configured to receive the first pull-up signal and pull-up the third input/output line, and a first pull-down element configured to receive the first pull-down signal and pull-down the third input/output line,
- wherein the first repeater further comprises:
- a second pull-up element configured to pull-up the first pull-up signal in response to the output signal of the delay unit;
- and
- a second pull-down element configured to pull-down the first pull-down signal in response to the output signal of the delay unit.
Dependencies are inferred from the claim text.