High-frequency circuit components
AssigneeNikon Corporation
InventorsYoshihiko Suzuki, Hiroshi Konishi, Madoka Nishiyama
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Abstract
High-frequency circuit components are disclosed in which parasitic capacitance between a high-frequency circuit element and a substrate is reduced and mechanical strength is improved. An exemplary component has a conductive substrate, a coil as the high-frequency circuit-element, a mounting board including a thin dielectric film on which the coil is mounted, and a support board that couples the mounting board to the substrate. The mounting board is coupled so that it floats relative to the substrate as a result of deliberate warping of the support board.
Claims18
A high-frequency circuit component, comprising:
- a substrate;
- one or more high-frequency circuit elements;
- and
- a board-like support member comprising a supporting portion and a mounting portion, at least the mounting portion comprising a thin dielectric film on which the one or more high-frequency circuit elements are mounted on the mounting portion, and the supporting portion comprising at least one leg by which the support member is coupled to a surface of the substrate such that the mounting portion, with the one or more circuit elements, floats in a cantilever manner relative to the substrate surface.
Dependencies are inferred from the claim text.