Heat sink device with a shielding member
AssigneeHon Hai Precision Industry Co., Ltd.
InventorsYu-Hua Ho, Ting-Wang Lin, Fu-Chin Yeh
Life of this patent
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Abstract
A heat sink device mounted on a circuit board including an electronic component includes a heat sink to dissipate heat generated by the electronic component and a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI). The heat sink includes a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base. The plurality of receiving grooves are arranged in rows around the plurality of heat fins. The shielding member includes a plurality of contact plates abutting against the circuit board and a plurality of receiving plates received in the plurality of receiving grooves.
Claims4
A heat sink device mounted on a circuit board comprising an electronic component, the heat sink device comprising:
- a heat sink to dissipate heat generated by the electronic component, the heat sink comprising a base, a plurality of heat fins extending upwardly from the base, and a plurality of receiving grooves defined in the base, wherein the plurality of receiving grooves are arranged in rows around the plurality of heat fins;
- and
- a shielding member electrically connecting the circuit board and the heat sink to prevent the electronic component from electromagnetic interference (EMI), the shielding member comprising at least one main body, at least one contact plate abutting against the circuit board and at least one receiving plate received in the plurality of receiving grooves, wherein at least one contact plate and receiving plate are integrally formed with the at least one main body to form a metal plate.
Dependencies are inferred from the claim text.