Suspension board with circuit
AssigneeNitto Denko Corporation
InventorsTetsuya Ohsawa, Naohiro Terada
Life of this patent
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Abstract
A stepped-part 4b with a lower tip side is formed on the top face of a pattern end 4, and a lower face 4c thereof is used as a plane on which a solder ball 7 is provided. One or more protrusions 4d made of a swollen conductive layer are formed on the lower face to limit displacement of the solder ball in the tip direction and the both side directions. The solder ball is held by the protrusions to suppress deviation of the solder ball.
Claims14
A suspension board with a circuit, which comprises a metal board comprising an area for mounting a magnetic head, and other area comprising a conductive layer provided on the metal board as a circuit pattern via an insulating layer, said circuit pattern having a pattern end to be a terminal for connection with a terminal of the magnetic head, the pattern end having, on its top face, a stepped-part with a lower tip side, wherein a lower face of the stepped-part is used as a plane to set a solder ball, and
- the lower face having one or more protrusions made of a swollen conductive layer to limit displacement of the solder ball at least in a tip direction, which is a direction from the stepped-part side toward the tip side, as well as displacement of the solder ball in both side directions, which are orthogonal directions relative to the tip direction.
Dependencies are inferred from the claim text.