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AssigneeQUALCOMM MEMS Technologies, Inc.
InventorsMing-Hau Tung, Brian W. Arbuckle, Philip Don Floyd, William Cummings
Estimating the term…
A support structure within an interferometric modulator device may contact various other structures within the device. Increased bond strengths between the support structure and the other structures may be achieved in various ways, such as by providing roughened surfaces and/or adhesive materials at the interfaces between the support structures and the other structures. In an embodiment, increased adhesion is achieved between a support structure and a substrate layer. In another embodiment, increased adhesion is achieved between a support structure and a moveable layer. Increased adhesion may reduce undesirable slippage between the support structures and the other structures to which they are attached within the interferometric modulator.
An electromechanical systems device, comprising:
An electromechanical device comprising:
An electromechanical device comprising:
An electromechanical device comprising:
Dependencies are inferred from the claim text.