Integrated circuit package-in-package system with wire-in-film encapsulant
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Seng Guan Chow, Heap Hoe Kuan, Linda Pei Ee Chua, Rui Huang
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Abstract
A multiple encapsulation integrated circuit package-in-package system includes: dicing a top integrated circuit wafer having a bottom encapsulant thereon to form a top integrated circuit die with the bottom encapsulant; positioning internal leadfingers adjacent and connected to a bottom integrated circuit die; pressing the bottom encapsulant on to the bottom integrated circuit die; connecting the top integrated circuit die to external leadfingers adjacent the internal leadfingers; and forming a top encapsulant over the top integrated circuit die.
Claims9
A multiple encapsulation integrated circuit package-in-package system comprising:
- a bottom integrated circuit die;
- internal leadfingers adjacent and connected to the bottom integrated circuit die;
- a bottom encapsulant over the bottom integrated circuit die and the internal leadfingers;
- external leadfingers adjacent the internal leadfingers;
- a top integrated circuit die bonded on the bottom encapsulant connected to the external leadfingers;
- a top encapsulant over the top integrated circuit die and the bottom encapsulant;
- and
- a stiffener over the top encapsulant.
Dependencies are inferred from the claim text.