Back to results
US 7,923,845 B2Granted
Alignment features for proximity communication
AssigneeOracle America, Inc.
InventorsAshok V. Krishnamoorthy, John E. Cunningham, James G. Mitchell
Life of this patent
Estimating the term…
Abstract
Embodiments of a semiconductor die that includes proximity connectors proximate to a first surface of the semiconductor die are described. This semiconductor die is configured to communicate signals with another semiconductor die via proximity communication through one or more of the proximity connectors. Moreover, the semiconductor die includes a positive feature coupled to a second surface of the semiconductor die that facilitates mechanical alignment of the semiconductor die with the other semiconductor die. Note that a first region around the positive feature defines a first plane, and the positive feature protrudes above the first plane.
Claims19
A semiconductor die, comprising:
- proximity connectors proximate to a first surface of the semiconductor die, wherein the semiconductor die is configured to communicate signals with a second semiconductor die via proximity communication through one or more of the proximity connectors;
- and
- a positive feature coupled to a second surface of the semiconductor die which facilitates mechanical alignment of the semiconductor die with the second semiconductor die, wherein a first region around the positive feature defines a first plane, and wherein the positive feature protrudes above the first plane;
- and
- a stress-relief material coupled to the positive feature, wherein the stress relief material is configured to provide mechanical relief from stresses caused by at least one of relative motion or temperature differences when the positive feature has been used to align the first semiconductor die with the second semiconductor die.
2 more elements
A system, comprising:
- a first semiconductor die;
- and
- a second semiconductor die,
- wherein the first semiconductor die includes a first set of proximity connectors proximate to a first surface of the first semiconductor die and is configured to communicate signals with the second semiconductor die via proximity communication through the first set of proximity connectors;
- wherein the second semiconductor die includes a second set of proximity connectors proximate to a second surface of the second semiconductor die and is configured to communicate signals with the first semiconductor die via proximity communication through the second set of proximity connectors;
- wherein the first semiconductor die includes a positive feature coupled to a third surface of the first semiconductor die and the second semiconductor die includes a negative feature coupled to a fourth surface of the second semiconductor die;
- wherein a first region around the positive feature defines a first plane and a second region around the negative feature defines a second plane;
- wherein the positive feature protrudes above the first plane and the negative feature is recessed below the second plane;
- wherein the positive feature couples to the negative feature, thereby facilitating alignment of the first set of proximity connectors and the second set of proximity connectors;
- and
- a stress-relief material coupled between the positive feature and the negative feature, wherein the stress relief material is configured to provide mechanical relief from stresses caused by at least one of relative motion or temperature difference between the first semiconductor die and the second semiconductor die.
8 more elements
A method for reducing misalignment between two semiconductor dies, comprising:
- positioning a first semiconductor die relative to a second semiconductor die, wherein the first semiconductor die and the second semiconductor die are configured to communicate signals via proximity communication through a first set of proximity connectors proximate to a first surface of the first semiconductor die and a second set of proximity connectors proximate a second surface of the second semiconductor die;
- and
- coupling a positive feature, which is coupled to a third surface of the first semiconductor die, to a negative feature, which is coupled to a fourth surface of the second semiconductor die, wherein the coupling facilitates alignment of the first set of proximity connectors and the second set of proximity connectors;
- wherein a first region around the positive feature defines a first plane and a second region around the negative feature defines a second plane;
- wherein the positive feature protrudes above the first plane and the negative feature is recessed below the second plane;
- and
- wherein coupling the positive feature to the negative feature includes coupling a stress-relief material between the positive feature and the negative feature, wherein the stress relief material is configured to provide mechanical relief from stresses caused by at least one of relative motion or temperature difference between the first semiconductor die and the second semiconductor die.
4 more elements
Dependencies are inferred from the claim text.